AMD Instinct MI300: first-gen exascale APU with Zen 4 CPU + CDNA 3 GPU

AMD will be unleashing its next-gen Instinct MI300 product family in the future, the first CDNA 3-based product that will utilize 3D stacking technology.

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3D stacking technology will allow AMD to use CPU and GPU dies in different configurations for customers of AMD, and now we have some new leaks making things a little clearer. From a leaked slide from a purported internal presentation on AMD's upcoming Instinct MI300, AMD says the Instinct MI300 is a "first generation Instinct APU".

AdoredTV details the slides (you should be able to tell their AdoredTV's slides, I don't know if it's obvious enough or not) that one of the CPU configurations -- leaker Tom @ Moore's Law is Dead said that recently, more on that below -- with Zen 4-based CPU cores, and CDNA 3-based GPU cores.

• Read more: AMD Instinct MI300 GPU: 3D die-stacking, HBM3, PCIe 5.0, 600W+ power
• Read more: AMD RDNA 3 GPU: engineer confirms hybrid 5nm + 6nm nodes on Navi 3X
• Read more: AMD to use 4 GPU chiplets on next-gen Instinct MI300 GPU

With all of the major components on a single package -- Zen 4 CPU cores, CDNA 3 GPU cores, and HBM -- this is the world's largest (by far) x86-based APU for datacenters. AMD's next-gen Instinct MI300 looks like it pops its huge APU head up in the leaked slide, where we can see at least 6 HBM stacks and what appears to be a socketed processor.